3rd Gen Intel Xeon Scalable Servers
Processor - Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
Memory - Up to 32 DIMM slots, 16 per CPU with up to eight Intel Optane DC DIMMs per CPU
Disk - Up to eight SAS/SATA/NVMe drive bays with embedded RAID technology
Expansion - Up to three PCIe Gen4 slots
Special Features- One OCP expansion module slot for up to 100Gbe Ethernet support, five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, Integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, Redundant 1300W AC Titanium Power Supply Units
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. The E-1800 R6 enterprise computing system delivers the industry’s best combination of high performance, reliability, and flexibility to match medium-density storage and I/O requirements and is optimized for a variety of cloud, AI, security, and HPC workloads. This system features support for 12 SSDs in a 1U, small form factor design, and networking support for scale-out, hyperconverged environments.
Processor - Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
Memory - Up to 32 DIMM slots, 16 per CPU with up to eight Intel Optane DC DIMMs per CPU
Disk - Up to 12 SAS/SATA/NVMe drive bays with embedded RAID technology
Expansion - Up to three PCIe Gen4 slots
Special Features- One OCP expansion module slot for up to 100Gbe Ethernet support, five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, Integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, Redundant 1300W AC Titanium Power Supply Units
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. The E-1800 R6 enterprise computing system delivers the industry’s best combination of high performance, reliability, and flexibility to match medium-density storage and I/O requirements and is optimized for a variety of cloud, AI, security, and HPC workloads. This system features support for 12 SSDs in a 1U, small form factor design, and networking support for scale-out, hyperconverged environments.
The UNICOM Engineering team is standing by to learn about your business and help you identify the technology and services that can transform your solutions and provide a competitive advantage. The quicker we start to engage the faster this can happen. We’ve provided some baseline information above, but we are much more engaging in person. Let’s discuss the technology and services that will optimize your application and drive performance.