Density and performance for next generation data center

This is where the zettabytes of data will be stored and analyzed daily. As this demand increases, so does density requirements and energy consumption, with 40% of a data center's typical power cost coming from cooling. At the same time, data centers are under pressure to increase efficiency, sustainability, and reduce their overall carbon footprint. And to compound existing challenges, technology is about to outpace what traditional air cooling methods can efficiently handle in the same form factor. All of this fuels the need for alternative cooling methods to meet the challenges and aptly address sustainability initiatives.

Direct to Chip Liquid Cooling (DCLC) and immersion are the future of cooling due to their inherent efficiency and density capabilities. In the simplest of terms, liquid methods perform a similar task to air by dissipating the heat from components like CPUs, GPUs, and accelerators and pulling it away from the hardware. As workloads become more demanding and these components become more powerful, their Thermal Design Power (TDP) increases. As TDP reaches and exceeds 350W, systems will require larger heat sinks and more space to cool with air effectively. Alternately, DCLC and immersion allow denser solutions with a smaller footprint while significantly reducing cooling costs.